装机笔记

字数 1940 · 2020-03-05

主板

规格

  • EATX - 330mm * 305mm
  • ATX - 244mm * 305mm
  • MATX - 244mm * 244mm
  • Mini-ITX - 170mm * 170mm
  • Nano-ITX - 120mm * 120mm

芯片组

Intel

700 Series

13th Gen Core

Z790

600 Series

12th Gen Core

Z690 B660 H610

500 Series

11th Gen Core

400 Series

10th Gen Core

PCIe

Peripheral Component Interconnect Express

Power

  • x1 cards are limited to 0.5 A at +12 V (6 W) and 10 W combined.
  • x4 and wider cards are limited to 2.1 A at +12 V (25 W) and 25 W combined.
  • A full-sized x1 card may draw up to the 25 W limits after initialization and software configuration as a “high power device”.
  • A full-sized x16 graphics card may draw up to 5.5 A at +12 V (66 W) and 75 W combined after initialization and software configuration as a “high power device”.

Optional connectors add 75 W (6-pin) or 150 W (8-pin) of +12 V power for up to 300 W total (2x75 W + 1x150 W).

  x1 x2 x4 x8 x16
1.0 250 MB/s 0.50 GB/s 1.00 GB/s 2.0 GB/s 4.0 GB/s
2.0 500 MB/s 1.00 GB/s 2.00 GB/s 4.0 GB/s 8.0 GB/s
3.0 984.6 MB/s 1.97 GB/s 3.94 GB/s 7.88 GB/s 15.75 GB/s
4.0 1969 MB/s 3.94 GB/s 7.88 GB/s 15.75 GB/s 31.51 GB/s
5.0 3938 MB/s 7.88 GB/s 15.75 GB/s 31.51 GB/s 63.02 GB/s

USB

Universal Serial Bus

  Transfer speed
USB 2.0 480 Mbit/s (60 MB/s)
USB 3.x Gen 1 5Gbit/s (625MB/s)
USB 3.x Gen 2 10Gbit/s (1.25GB/s)
USB 3.2 Gen 2 x 2 20 Gbit/s (2.5GB/s)

USB 3.1, released in July 2013 has two variants. The first one preserves USB 3.0’s SuperSpeed transfer mode and is labeled USB 3.1 Gen 1, and the second version introduces a new SuperSpeed+ transfer mode under the label of USB 3.1 Gen 2. SuperSpeed+ doubles the maximum data signaling rate to 10 Gbit/s.

USB 3.2, released in September 2017,preserves existing USB 3.1 SuperSpeed and SuperSpeed+ data modes but introduces two new SuperSpeed+ transfer modes over the USB-C connector with data rates of 10 and 20 Gbit/s (1.25 and 2.5 GB/s).

  • Mini-A
  • Mini-B
  • Micro-A
  • Micro-B
  • Type-A
  • Type-B
  • Type-C

网卡

千兆 2.5 G 万兆
125M/s 300M/s 1.25G/s

Wifi

Gen IEEE Mbit/s Date GHz
Wi-Fi 6 802.11ax 600 ~ 9608 2019 2.4/5
Wi-Fi 5 802.11ac 433 ~ 6933 2014 5
Wi-Fi 4 802.11n 72 ~ 600 2008 2.4/5
Wi-Fi 3 802.11g 6 ~ 54 2003 2.4
Wi-FI 2 802.11a 6 ~ 54 1999 5
Wi-Fi 1 802.11b 1 ~ 11 1999 2.4

SSD

M.2

  M.2 2280 M.2 2260 M.2 2242
Size 22 x 80 22 x 60 22 x 42

主控

缓存

闪存

SLC MLC TLC QLC

TBW - max terabytes written - 最大 TB 写入量

https://ark.intel.com/content/www/us/en/ark.html

GPU

CUDA

CUDA (Compute Unified Device Architecture) is a parallel computing platform and application programming interface * (API)* model created by Nvidia.

Scalable Link Interface (SLI) is a brand name for a multi-GPU technology developed by Nvidia for linking two or more video cards together to produce a single output.

At a transfer rate of 1 GT/s, the data rate would be 8 × 10^9 B/s, i.e. 8 GB/s, or approximately 7.45 GiB/s. The bit rate for this example is 64 Gbit/s (8 × 8 × 109 bit/s).

内存

时序

延迟

RAID

  • RAID 0
    • split data evenly across disks
    • no redundancy
    • no fault tolerance
    • n times read and write
  • RAID 1
    • copy data across disks
  • RAID 2
  • RAID 3
    • rarely used in practice
Level Desc Min Space Tolerance Read Write
RAID 0 Block-level striping 2 1 None n n
RAID 1 Mirror 2 1/n n - 1 n 1
RAID 4 Block-level striping + dedicated parity 3 1 - 1/n 1 n - 1 n - 1
RAID 5 Block-level striping + distributed parity 3 1 - 1/n 1 n  
RAID 6 Block-level strubg + 2x distributed parity 4 1 - 2/n 2 n  

Nested RAID

  • RAID 10

Intel

Core

酷睿

Suffix Meaning
X / XE Unlocked, High End
K Unlocked
F Requires discrete Graphics
T Power-optimized
Y Moblie extremely low power
E Embedded
H High performance optmized for mobile
U Mobile power efficient

Series

  • 12/11/10/9/8 gen i9
  • 12/11/10/9/8/7/6/5/4 gen i7/i5/i3
  • 8/7/6 gen m (mobile)

12th

  i9 i7 i5 i3
Cores 14 ~ 16 10 ~ 16 6 ~ 12 4 ~ 10
Turbo (GHz) 4.8 ~ 5.5 4.6 ~ 5.0 4.2 ~ 4.9 4.4

10th

  i9 i7 i5 i3
Thermal Velocity Boost Y N N N
Turbo Boost Y Y N N
Single Core Turbo 5.1 5.0 4.8 4.6
Max Cores 10 8 6 4
Smart Cache (MB) 20 16 12 8
Memory 2933 2933 2666 2666

Pentium

奔腾

  • Silver
    • (?<prefix>[A-Z])(?<sku>[0-9]{4})
    • optimized for cost
  • Gold
    • (?<sku>[0-9]{4})
    • optimized for performance

A Higher number indicates improved features and benchmarks.

Series Cores Date Platforms
Gold 2 ~ 5 Q1’19 ~ Q1’22 D / E / M
Silver 4 Q4’17 ~ Q1’21 M
D 2 ~ 4 Q4’15 ~ Q2’16 E / S
G 2 Q1’13 ~ Q1’17 D / E
J 4 Q3’13 ~ Q1’21 D / E
N 4 Q3’13 ~ Q1’21 E / M
6800 2 Q4’20 M
4000 2 Q3’15 M
3000 2 Q3’13 ~ Q1’15 M
2000 2 Q3’12 ~ Q3’15 M
1000 2 ~ 4 Q2’12 ~ Q1’16 E / M / S

D - Desktop
E - Embedded
M - Mobile
S - Server

Xeon

至强

  • Scalable Processor
  • D Processor
    • Workload optimized
  • E Processor
    • Essential
  • W Process
    • Workstation
    • creative processionals (VFX, 3D rendering, 3D CAD)

Scalable Processor

First Digit Meaning
9 / 8 Platinum
6 / 5 Gold
4 Silver
3 Bronze
Second Digit Meaning
1 1st gen
2 2nd gen
3 3rd gen

Third and fourth digits indicate the SKU number

Suffix Meaning
N Network
… …

Celeron

赛扬

  • (?<sku>[0-9]{4})
  • (?<prefix>[A-Z])(?<sku>[0-9]{4})

A Higher number indicates improved features and benchmarks.

Series

Series Cores Date Platforms
G 2 Q1’13 ~ Q1’22 D / M
J 2 ~ 4 Q3’13 ~ Q1’21 D / E / M
N 2 ~ 4 Q3’13 ~ Q1’22 E / M
7000 5 Q1’22 ~ Q1’22 E / M
6000 2 Q4’20 ~ Q3’21 E / M
5000 2 Q4’19 ~ Q2’20 M
4000 2 Q1’19 E / M
3000 2 Q1’15 ~ Q1’19 E / M
2000 2 Q3’13 ~ Q2’14 E / M
1000 2 Q1’13 ~ Q3’13 E / M
  • J4125
  • N5105

Code Name

CodeName Node Year
Sandy Bridge 32mm 2010
Ivy Bridge 22nm 2011
Haswell 22nm 2013
Broadwell 14nm 2014
Skylake 14nm 2015
Coffee Lake 14nm 2017
Cascade 14nm 2019
Comet Lake 14nm 2019
Cooper Lake 14nm 2020
Ice Lake 10nm 2021
Rocket Lake 14nm 2021
Tiger Lake 10nm 2021
Alder Lake 10nm 2021

超频

AMD

PBO

锁频降压

3900x 1.1v 3.95 Ghz 45 ~ 66 °C
3900x 1.1v 4.00 Ghz 48 ~ 67 °C

网线

CAT-5 100 Mbps
CAT-5e 1000 Mbps
CAT-6 1000 Mbps
CAT-7 10 Gbps